Pages | Film | Contents |
---|---|---|
1 | 1 | Layer 1, Top component layer (Signal_1) |
2 | 2 | Layer 2, Vcc power plane |
3 | 3 | Layer 3, Ground plane |
4 | 4 | Layer 4, Inner signal layer (Signal_3) |
5 | 5 | Layer 5, Inner signal layer (Signal_4) |
6 | 6 | Layer 6, A Vcc power plane |
7 | 7 | Layer 7, AGND plane |
8 | 8 | Layer 8, Bottom component layer (Signal_2) |
9 | 9 | Top solder mask |
10 | 10 | Bottom solder mask |
11 | 11 | Top silkscreen |
12 | 12 | Bottom silkscreen |
13 | 13 | Top paste mask |
14 | 14 | Bottom paste mask |
15 | 15 | Mill plot |
16 | 16 | Drill plot |